Job title: Engineer – Bond/Grind/Trim Process Dev
Company: Micron
Job description: Process module ownership involving Bonding/Grind/Trim process characterization and advanced process development for 3D… NAND and beyond. Work with process development engineers in Singapore and Boise, US TD site and vendors to develop…
Expected salary:
Location: Singapore
Job date: Wed, 02 Jul 2025 00:36:22 GMT
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